陈晓挺, MathWorks
单博, MathWorks
本讲的第二部分中,我们会谈到SoC (片上系统) 的软硬件联合设计挑战,并为大家介绍如何采用基于模型的设计方法进行SoC的设计。软/硬件统一在Simulink®设计坏境中,完成算法验证后,软件部分自动生成嵌入式C代码,硬件部分生成HDL代码,随后可进行联合仿真,也可进行FPGA在环的半实物仿真,并可根据实际仿真结果灵活的调整软硬件的划分:
录制日期: 2016年5月10日
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